Area Array Packaging Handbook: Manufacturing and Assembly

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Area Array Packaging Handbook:...

Area Array Packaging Handbook: Manufacturing and Assembly

Name: Area Array Packaging Handbook: Manufacturing and Assembly
ISBN: 9780071374934

Ken Gilleo

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*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Kategori:

Engineering

Tahun:

2001

Edisi:

Penerbit:

McGraw-Hill Professional

Bahasa:

english

Halaman:

782

ISBN 10: